Following is an excerpt of some of equipment we now have available. Please keep in mind that equipment comes in and goes out practically daily. If you require any equipment which does not appear in our listing, please don´t hesitate to ask for it. We will be happy to send you a quotation with detailed information.

Hughes, Automatic wire bonder 2460-II

Automatic thermosonic gold ball bonder with pattern recognition
Item-No.: 6.31

Hybond, Wedge Bonder Deep Access Thermosonic Wire, 532-12-22-24-27

Wedge Bonder, Deep Access Thermosonic Wire, 532-12-22-24-27
Item-No.: 6.20

Hybond, Wedge Bonder 552-12-17-30

Item-No.: 6.24

Hybond, Deep Access Bonder 572-40-30A-43-19A-1731

Deep Access - Deep Reach thermosonic gold wire and ribbon wedge bonder
Item-No.: 6.25

Hybond, Deep Access Bonder 572, Model: 572-12-13-17-20-31

Item-No.: 6.33

Karl Suss, Anodic Bonder BA 6000

Anodic Bonder designed for anodic bonding in vacuum, substrate size 100mm and 125 mm, vacuum generation via Leybold BHV 10 and TurboVac 50, Bertan 206B high voltage DC power supply, heatable chuck, 3 electrodes, Splitfield microscope with fiber obtics and c-mount
Item-No.: 6.30

Kulicke & Soffa, Ball Bonder 4524

Item-No.: 6.19

Mech-El, Ultrasonic Aluminum Wedge Bonder Model 909X

Ultrasonic Aluminum Wedge Bonder, can also be used for Gold Wire, AL 17, 5-31?, AU 17, 5-50?, including Microscope
Item-No.: 6.6

Orthodyne Electronic, Thick Wire Bonder 20 -

Bonds 4 to 20 mil aluminium wire, also capable of bonding 4 to 15 mil gold wire
Item-No.: 6.2

Orthodyne Electronic, Heavy Wedge Wire Bonder

Heavy Wedge Wire Bonder
Item-No.: 6.26

Precimeca, Thick Wire Bonder Model 432

For max. 200? thick wire
Item-No.: 6.5