Reinraumtechnik Lanz´s offer
Following is an excerpt of some of equipment we now have available. Please keep in mind that equipment comes in and goes out practically daily. If you require any equipment which does not appear in our listing, please don´t hesitate to ask for it. We will be happy to send you a quotation with detailed information.
Branson/IPC, Plasma Stripper L 3200/5
Photoresist (Plasma) Stripper, Carrier to Carrier, 2 Chambers, Set up for 150mm Wafers
Item-No.: 2.12
Branson/IPC, Barrel Plasma Etcher 2000
2000 Barrel Plasma Etcher, Plasma Process Reactor with 1500 Watt Generator - Model 04015
Item-No.: 2.32
Buck Plasma Elektron, Plasma Reactor Domino 80
Plamsa Reactor for surface treatment of polymer, metallic or glass materials
Item-No.: 2.35
FSI, Spray Processing System Mercury OC
Spray Processing System
Item-No.: 2.30
Fusion, Ozone Stabiliser M 150PC
Through UV Bake the substrate resist allows for increased consistency for further processes - Fully automatic - Cassette to cassette
Item-No.: 2.33
International Plasma, Plasma System 2105
Barrel etcher, Dual, each Dia = 200 mm x 450 mm
Item-No.: 2.9
Plasma Therm, Plasma Etcher PK 1241
Single Reactive Ion and Plasma Etch Automatic System - This single system achieves reactions needed to produce constant physical and chemical etching on the wafer surface.
Item-No.: 2.34
STS, Plasma Etching System 508 PC
Plasma Etching System
Item-No.: 2.39
Technics Plasma, Ion Etcher MIM TLA-20
Ion Etcher MIM TLA-20, especially suited for R+D permitting a wide range of processes such as: IBE: Ion Beam Etching (Ar through source), RIBE: Reactive Ion Beam Etching (Ar+R through source), CAIBE: Chemically Assisted Ion Beam Etching (Ar through source + R through r
Item-No.: 2.29
Reinraumtechnik
Lanz´s reliable, new HMDS Oven for pre-programmed dehydration
and vapor deposition to generate photoresist adhesion. This newly
developed vapor prime oven is controlled via a PLC with an easy-to-use
touch panel.