Karl Suss, Anodic Bonder BA 6000
Anodic Bonder designed for anodic bonding in vacuum, substrate size 100mm and 125 mm, vacuum generation via Leybold BHV 10 and TurboVac 50, Bertan 206B high voltage DC power supply, heatable chuck, 3 electrodes, Splitfield microscope with fiber obtics and c-mount
Reinraumtechnik
Lanz´s reliable, new HMDS Oven for pre-programmed dehydration
and vapor deposition to generate photoresist adhesion. This newly
developed vapor prime oven is controlled via a PLC with an easy-to-use
touch panel. 