Reinraumtechnik Lanz, Germany, offers new and used semiconductor manufacturing equipment worldwide at favorable prices. Also service and spare parts. We also buy surplus.

Following is an excerpt of some of the equipment we now have available. Please keep in mind that equipment comes in and goes out regularly. lf you require any equipment which does not appear in our listing, please don’t hesitate to ask for it. You can reach us at +49-7531-94234-0 or send an eMail.

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Manufacturer	Model / Type	RRTL-No.	Details
Alcatel	ASM110T - as is / where is - Portable device consisting of a pre-adjusted mass spectrometer and high vacuum pump.	19.23
Alcatel	SCM 600 Sputtering System used for deposition by cathodic sputtering, substrate size 4inch, RF and DC sputtering, loadlock	1.36
AST	LPCVD Oven LPCVD 2-tube oven for Diff Oyxde and LPCVD Nitride, including loader, flowbox and PC	16.16
AST	SHS 200 Super Heat System Super Heat System is a rapid thermal wafer heating system designed for various applications within the semiconductor industry. Wafers are heated by high-intensity radiation for short periods (1-300 sec) at controlled temperatures.	12.69
Balzers	BA 710 Compact Bell-Jar High Vacuum Coater	1.46
Balzers	BAK 750 Compact High Vacuum Coater - Various configurations possible, with substrates turn over calottes	1.49
Balzers	BAK 760 Compact High Vacuum Coater - Various configurations possible.	1.14
Balzers	Experimental High Vacuum Chamber Chamber ID=400 mm, OD=450 mm, Height approx. 300 mm, with window D=100 mm, mounted on a standframe, including controlling	1.23
Balzers	HLT 150 Leakdetector	8.84
Balzers	LLS 801 Planar Magentron Balzers LLS 801 Sputter system with Loadlock, substrates up to 150mm	1.XX
Balzers	LLS 900 Balzers LLS 900 Sputter system for RF and DC with Loadlock - automatic loading system - max. 4 targets - Sputter etching - substrate heating in loadlock and process chamber	1.YY
Balzers	UMS 500 P Ultra-High Vacuum System - Various configurations possible.	1.2
Balzers Union Limited	SCD 040 Sputter Coater with rotation pump DUO 004B - 4m³ / 2-stage, used	1.48
Balzers/Pfeiffer	UHV Test Chamber TSU 510 Including: Pfeiffer/Balzers Pumping Unit Control TCS 100, Pfeiffer/Balzers Power Supply TCP 310, Balzers Partial Pressure Gauge QMG 064, Balzers QME 064, Pfeiffer/Balzers DUO 030A Pump	19.20
BIO-RAD	FTS 60 - as is / where is - Infrared Spectrometer	8.60
Blue M Electric - as is / where is -	Inert Gas Oven IGF-6680-JY Temperature max: 593°C	12.3
Blue M Electric - as is / where is -	Inert Gas Oven IGF-6680-JY Temperature max: 593°C	12.29
Branson / IPC	2000 Barrel Plasma Etcher Plasma Process Reactor with 1500 Watt Generator - Model 04015	2.32
Branson / IPC	L 3200/5 Photoresist (Plasma) Stripper, Carrier to Carrier, 2 chambers, set up for 150 mm wafers	2.12
Buck Plasma Elektronik	Domino 80 Plasma Reactor Plasma Reactor for surface treatment of polymer, metallic or glass materials	2.35
Canon	LSF 500 Laser Scanning Flatness Tester including Rohhe & Schwarz Oscilloscope, Canon Controller	8.52
CEAST	Impact Testing Machine Prabender 6545	19.16
Centrotherm	Centronic Lab 1200 - Model CVD-1-250 Deposition Temperature: 400 to 1200°C, +/- 0,5°C - controlled automatically, with Controller CPS 382-11	16.4
Climet	CI 8060 - as is / where is - Particle Counter	8.21
Convac	CRA 1-1 One Track High Pressure Cleaner	7.1
Convac	CSE 9 For cleaning substrates with burnable medias	13.30
Convac	Model 301G Coater for Square Substrates, including GEAR-Set	4.22
Convac APT	3040 Spray Etcher For square substrates	7.3
Disco	DAD-2H6 Automatic Dicing Saw for substrates up to 150 mm	5.40
Disco	DFD 641 Automatic Dicing Saw	5.41
Disco	DWT-13RII - as is / where is - Water Temperature Control Unit	5.30
Elektro-Wärme-Aachen	VRTK 40 Vacuum Drying Oven, 40l	12.74
ENI Power-Systems	O2-Stripper, PL-1HF, Plasmaloc1-HG	2.40
EVG	101 Spin Coater Coater with dispense system	4.100
Faith	Rapitran I Model 55024 - Wafer Transfer System for 25x 100mm Wafers	11.11
Faith	Rapitran I Model 55024 - Wafer Transfer System for 125mm Wafers	11.24
Faith	Rapitran I Model 55024 - Wafer Transfer System for 125mm Wafers	11.26
Faith	Rapitran I Model 55021 - Wafer Transfer System for 125mm Wafers	11.25
Faith	Rapitran I Model 55024 - Wafer Transfer System for 125mm Wafers	11.27
Faith	Rapitran II Model 550125 for 125mm wafers	11.22
Faith	Rapitran II Model 550125 for 125mm wafers	11.23
Four Dimensions Inc.	Automatic Sheet Resistivity Prober 280	19.15
FSI	Mercury OC Spray Processing System	2.30
FSI	PHOENIX Double stack Rinser / Dryer	13.57
FSI	PHOENIX Horizontal, Single-Cassette Rinser / Dryer; several systems available	13.58
Fusion	M 150PC Ozone Stabiliser Through UV Bake the substrate resist allows for increased consistency for further processes - Fully automatic - Cassette to cassette	2.33
Gaertner	L126-B - as is / where is - Ellipsometer, including new software from Gaertner and new laser	8.50
GERO GmbH	F100-500 High Temperature Furnace up to 1.300°C	12.64
HDL	Wafer Transfer System	11.21
Heraeus	Diffusion Oven for max. 4" Wafer, up to 1000°C	12.49
Heraeus	K 750/1 Tempering Furnace, Temperature 750°C	12.76
Heraeus	Muffle Furnace up to 1.100°C	12.63
Heraeus	T 5042 EK Temperature: 300°C, Chamber Size: 425 x 330 x 355	12.32
Heraeus	T5110E Drying Oven Heraeus T5110E Drying Oven, Maximum Temperature: 250°C, Inner dimensions 1050 x 485 x 500 mm	12.7
Heraeus	UT 5036 Temperature: 230°C, Inner Dimensions: 360x360x670 mm (wxdxh)	12.75
Heraeus	UT 5042 EK Temperature: 300°C, Chamber Size: 420x 295x 355 mm	12.11
Heraeus-Vötsch	VMT 04/16/HT Mini test chamber, Temperature - 40°C to + 100°C, Inner Dimesions:30,5 x 20 x 23 cm (wxhxd), Outer Dimensions: 48 x 63 x 51 cm (wxhxd)	12.77
Hughes	2460-II Automatic thermosonic gold ball bonder with pattern recognition	6.31
Hybond	532-12-22-24-27 Wedge Bonder, Deep Access Thermosonic Wire, with temperature controller	6.20
Hybond	552-12-17-30 Wedge Bonder with temperature controller	6.24
Hybond	572-12-13-17-20-31 Deep Access Bonder	6.33
Hybond	572-40-30A-43-19A-1731 Deep Access - Deep Reach thermosonic gold wire and ribbon wedge bonder	6.25
International Plasma Corporation	2105 Plasma System Barrel etcher, Dual, each Dia = 220 x 450 mm	2.9
Jean Wirtz	Phoenix Beta Lapping & Polishing Machine	14.101
Karl Suss	604004 Probe System with Split Field Microscope	19.35
Karl Suss	Anodic Bonder BA 6000 Anodic Bonder designed for anodic bonding in vacuum, substrate size 100mm and 125 mm, vacuum generation via Leybold BHV 10 and TurboVac 50, Bertan 206B high voltage DC power supply, heatable chuck, 3 electrodes, Splitfield microscope with fiber obtics and c-mount	6.30
Karl Suss	MA 56 Mask Aligner, cassette to cassette; also suitable for manual mode. Configured according to your needs -- for up to 125mm dia wafers - completely refurbished -	4.XX
Karl Suss	SM 240 Spin Coater - as is / where is	4.64
Kehtec	689 C 3inch Projection Mask Aligner with automatic wafer loading (carrier system), wafer diameter between 2" and 3 1/4", resolution approx. 3µm	4.102
Kulicke & Soffa	4129 Deep Access Wedge Bonder for aluminum or gold wire (0.7 to 2.0 mil)	6.4
Kulicke & Soffa	984-10 Dicing saw with 4" Dicing blades for hard materials, up to 10" x 10" substrates	5.43
Kulicke & Soffa	Model 4524 Semiautomatic Ball Bonder	6.19
Leitz Ergolux	020-448.026 - as is / where is - Inspection and line-width measuring microscope	3.67
Leybold	Univex 300 Table-top evaporation system with glas respectively stainless-steel bell; equipped with e-gun, thermal evaporator and substrate heating; with TurboVac 361 high vacuum pump; system can be easily adapted to customer´s requirements	1.47
Leybold	Univex 450C - Clustertool 2 chamber system for RF- and DC-Sputtering, single wafer from cassette to cassette with roboter	1.42
Leybold Heraeus	L 560 Evaporator with cryo pump and compressor, various configurations available	1.VV
Logitech	1 PS21/PS M1 - as is / where is - Lapping & Polishing machine	14.105
Logitech	E306A - as is / where is - Wax-Layer Coating System	1.28
Mactronix	Eureka UKA-525 Wafer Transfer Machine	11.1
Mactronix	Eureka UKA-650 - as is / where is - Wafer Transfer System	11.13
Mech-El	Model 909X Ultrasonic Aluminum Wedge Bonder, can also be used for Gold Wire, AL 17, 5-31µ, AU 17, 5-50µ, including Microscope	6.6
Mech.El-Industries Inc.	TU 909 ZX - as is / where is - Wedge Bonder, without microscope, without ultrasonic generator	6.34
Micro Automation	Model 140 Mounting Station	5.22
Nabertherm	R50/750/1225/S - as is / where is - 1-Stack Ceramic Tube Oven	12.20
Nanometrics	Nanospec AFT - as is / where is - Film Thickness Measurement System Scanning UV 216 OS/2, for up to 8" Wafers	8.54
Nanometrics	Nanospec AFT - as is / where is - Film Thickness Measurement System Scanning UV 216 OS/2, for up to 8" Wafers	8.63
Newport Corporation (NRC)	F-IM2 - as is / where is - Optical Fiber Mircointerferometer	8.98
Orthodyne Electronics	Heavy Wedge Wire Bonder Heavy Wedge Wire Bonder with Bausch & Lomb Microscope	6.26
Orthodyne Electronics	Thick Wire Bonder -20- Bonds 4 to 20 mil aluminium wire, also capable of bonding 4 to 15 mil gold wire	6.2
Panacol-Elosol	KD-27000 X-Y-Z Dispensing System - as is / where is -	14.107
Perkin-Elmer	Infrared Spectrophotometer 682	8.69
Pink Vakuumtechnik	Sputtering System Sputtering System max. 3 targets, RF- and DC Sputtering, for foil with max. 12" or substrates max. 12" x 12"	1.37
Plasma Therm	PK 1241 Plasma Etcher Single Reactive Ion and Plasma Etch Automatic System - This single system achieves reactions needed to produce constant physical and chemical etching on the wafer surface.	2.34
Powatec	650 Wafer mounter	5.42
Precima International	Microtester MC 15 Wire pull tester up to 50 grams	19.7
Precimeca	Thick Wire Bonder - Model 432 For max. 200 µ thick wire	6.5
RECIF	Transfer Machine - as is / where is - For 5" wafers 5 units available - as is -	11.28
Reipro	Galvanomaster E2 - as is / where is - Small galvanisation system	9.37
Sam Song Automatic	Wafer Mounter S 600 for up to 8" wafers	5.28
Scan Tool Works	Belt Oven STW 110 IR Belt oven, speed 100-2000mm, heat 2125 W, working area 100mm, max. temperature 300°C	12.33
Sentech Instruments GmbH	FTP 500 Film thickness Prober	8.85
Speedfam	Free Abrasive Machine, QM 53 - as is / where is -	14.100
STS	508 PC Plasma Etching System	2.39
Taber Industries	Digital Abraser with LED Readouts 5151 Precision built test instrument designed to evalute the resistance of surfaces to rubbing abrasion.	19.36
Technics Plasma	MIM TLA-20 Ion Etcher, especially suited for R+D	2.29
Telesonic / Ultrasonic	USP-750 Ultrasonic Plastic Welding system - as is / where is -	14.106
Tempress	Omega Junior, 23678 Diffusion Oven	12.60
Tencor	P-2 Open Frame Profiler Long Scan Profiler - configuration open frame - accomodates large samples. Computerized, high-sensitivity surface profiler that measures roughness, waviness, and step height in a variety of applications.	8.100
Utilis	Sputtering System Surface treatment for tools (Titannitride), Plant and power distributor rack with control by PLC, 5kW DC power supply for DC deposition	1.40
Vagatherm	PVD 550 Ideal system for diverse cleanroom applications. The system includes 4-pocket e-beam evaporator, sputtering source, substrate heating, rotary and cryo pump.	1.39
WTB Binder	VD 23 Vacuum Oven Nominal Temperature: 200°C, 3.4A, 4 heights, 2 racks	12.30
WTB Binder	VD 23 Vacuum Oven Nominal Temperature: 200°C, 3.4A, 4 heights, 2 racks	12.38
WTB Binder	VD 23 Vacuum Oven Nominal Temperature: 200°C, 3.4A, 4 heights, 2 racks	12.39
WTB Binder	VD 23 Vacuum Oven Nominal Temperature: 200°C, 3.4A, 4 heights, 2 racks	12.40
Zeiss	MCS 320/30 Dualfotospectrometer, 19" housing, including monitor	8.58

Last update: April 24, 2008